TD-LTE chip: 28nm process matures

At the 2012 China International Information and Communication Exhibition, the reporter discovered that TD-LTE has developed rapidly on the basis of the technology and industry laid by TD-SCDMA, and has built an end-to-end industrial chain that is dominated by Chinese enterprises and widely supported by international manufacturers. In terms of terminal chips, more than 17 well-known domestic and foreign companies have joined the TD-LTE industry. Among them, Marvell, Chuangyi Video, Zhongpu Microelectronics, Spreadtrum, Lianxin Technology and other manufacturers have launched a series of support TD-LTE at this exhibition. LTE chip products. Previously, the development of multi-mode chips, the introduction of single-chip solutions, and the realization of 28nm technology have been the technical bottlenecks of TD-LTE terminal product development. It can be found at this exhibition that with the efforts of chip manufacturers, the related difficulties are Gradually being overcome, the pace of commercialization of TD-LTE is gradually approaching.

The picture shows the audience carefully watching the latest products of Lianxin Technology

Multi-mode chips as the highlight

TD-LTE technology has broad development prospects in the future of mobile communications, especially in the field of mobile broadband. Many operators around the world have shown great interest in TD-LTE technology. The success of TD-LTE requires three major elements, namely network, terminal and content application, and the chip is the core of the terminal product. In order to meet the requirements of different operators for voice service support after the introduction of LTE networks, the chip needs to support voice solutions. Since LTE does not carry voice services, voice communication is decentralized to 2G and 3G. Therefore, multi-mode chips must be used. Multi-mode chips have become the focus of TD-LTE development.

At this exhibition, various chip manufacturers also focused on the display of TD-LTE multimode chips. At the booth of the TD Industry Alliance, Spreadtrum displayed a SC9610, a TD-LTE chip it developed. The single product adopts 40nmCOMS process, integrates multi-mode standards in a single chip, including multi-band TD-LTE and TD-SCDMA, and EDGE / GS / GPRS, reaching 100Mbps downlink speed and 50Mbps uplink speed, supporting 5M, 10M, 15M And 20MHz channel bandwidth and 2 & TImes; 2MIMO, can be used for high-end smart phones and data cards. In addition, China Post also exhibited C8310, a multi-mode terminal solution supporting TD-LTE / TD-SCDMA / EDGE. Lianxin exhibited multi-mode terminal solutions supporting TD-LTE / LTE FDD / TD-HSPA / GGE.

In this regard, Li Chunchao, global vice president of MARVELL Mobile Products, said that multi-mode chips and multi-mode platforms are a trend. Of course, there are still many challenges in the implementation of this platform. If you want to make multi-mode products well, it is difficult to achieve by simply stacking some IP. In this case, the chip area will be large and the power consumption will increase. So it must be optimized, some of the different modules can be reused.

Single chip becomes a development trend

Multi-mode LTE smartphones generally need to be equipped with 3G chips and LTE baseband chips. Such an architecture poses great challenges for power consumption optimization. A single chip for system integration will be an important solution, and product development in this area also tests the capabilities of the enterprise.

In this regard, Xu Fei, vice president of sales of Zhongpu Microelectronics, said that regardless of 2G and 3G, in the end will take the road of a single chip, a mobile phone is limited in size, chip size will be an important consideration, so it will inevitably develop into a single chip. Li Chunchao also pointed out that if multi-mode chips are to be done well, they cannot just pile up different IPs. At present, more and more manufacturers in the market are devoted to the development of single-chip products. For example, MARVELL's PXA1802 exhibited at this exhibition is a TD-LTE 5-mode single chip, which can support both voice and data dual connectivity solutions .

28nm process will mature next year

The process is the key to the power consumption of the TD-LTE chip. The industry believes that the TD-LTE chip is more suitable for the 28nm process, but this process is not yet mature. 28nm or even a semiconductor process node higher than 14nm can reduce the chip design area and related power consumption.

In this regard, Xu Fei pointed out that the high-speed number throughput of TD-LTE will make its power consumption greater, so the production process of chips should be developed in the direction of 28nm. In the future, the amount of data transmitted by mobile phones will be more and more, and higher requirements will be placed on the duration of standby. If the throughput is greatly increased, the power consumption will also be greatly increased.

At present, more and more manufacturers have noticed this trend. For example, Lianxin pointed out in its technology evolution roadmap that it plans to adopt A9 dual-core in 2012, with a main frequency of 1.2GHz and a chip process of 40nm; in 2013, A15 dual-core A15 quad-core, the main frequency reaches 2.0GHz, the chip technology achieves 28nm; by 2014, the A15 quad-core processor will be used, the main frequency reaches 2.5GHz, and the chip technology achieves 22nm.

Li Chunchao also said that if 4G products realize a single chip, 28nm is indeed a better process. Of course, it is not that a single chip cannot be realized with 40nm, but the chip power consumption will be higher and the size will be larger.

Integration of TDD and FDD

At present, more and more operators are turning to the development of LTE, their understanding of TD-LTE has become more rational, and the market voice of Chinese standards is also constantly improving. There is a view that TDD and FDD will be integrated in the future. In this regard, Xu Fei pointed out that multi-mode coexistence is a relatively good phenomenon. Judging from the situation in many countries, the two networks may coexist. Everyone wants to take advantage of the download convenience of high-speed networks and remote high-speed video, all of which require the support of high-speed broadband networks. The trend of globalization has made people have any type of mobile phone that can roam around the world. Today's China's TD network is the world's largest network, but if our mobile phones go abroad, we may not be able to enjoy 3G services.

In the era of TD-LTE, if multi-standard interconnection can be achieved, the user experience will be greatly improved, which is also the hope of telecom operators. Therefore, the integration of FTD and TDD will be a development trend. Especially now that the spectrum has been fragmented, it may be difficult to correspond to FTD-LTE in many countries to find symmetrical spectrum. TD-LTE does not have this problem. Therefore, at present, the commercial level of TD-LTE is still slightly behind FDD, but after the commercialization of TD-LTE is mature, its advantage of asymmetric spectrum will be greatly reflected.

The picture shows the multi-mode single-chip PXA1802 exhibited by WARVELL

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